Ultrasound designers can now reduce form factor and improve image quality and reliability with the …
Embedded Computing
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Embedded ComputingEmbedded Systems
Rutronik introduces new Stamped CPU Heat Sink from ASSMANN WSW
by donpedroASSMANN WSW presents the newly developed “Stamped CPU Heat Sinks” series, a combination of “CROSS-CUT” …
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Embedded ComputingEmbedded Systems
MSC C6B-8S – Intel® Core™ – 4th Generation Type 6 Pin-out
by donpedroThe MSC C6B-8S module is based on Intel’s 4th generation of Core™ processors supporting triple …
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Embedded ComputingEmbedded Systems
PLS’ Universal Debug Engine now also available with its own debug perspective for the new Eclipse 4.x platforms
by donpedroPLS Programmierbare Logik & Systeme provides developers with the Universal Debug Engine (UDE) version 4.0.8 …
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COM Express Type 6 compact module with AMD R-Series processors With the R-Series, the second …
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Embedded ComputingEmbedded Systems
AMD Extends Ambidextrous Strategy to Embedded Customers Becoming the First to Offer Choice of ARM or x86 SoC, APU or CPU Options Coupled With Industry-Leading AMD Radeon Graphics
by donpedroAMD disclosed its roadmap for the fast-growing embedded computing market, as it becomes the first …
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Embedded ComputingEmbedded Systems
Rutronik distributes new industrial mainboard from Fujitsu supporting 3rd Gen Intel CoreTM processor and Windows 8
by donpedroFujitsu presents a new version of their industrial ATX mainboard D3128-B, the D3128-B2x. It now …
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Embedded ComputingEmbedded Systems
Get to Market Faster with an Accurate Integrated Isolated Energy Measurement Chipset for Embedded Applications
by donpedroDesigners can now measure AC or DC power usage from any phase without the need …
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Embedded ComputingEmbedded Systems
Major update to High Integrity C++ Coding Standard (HIC++)
by donpedroHIC++, one of the most respected and longest established coding standards for C++, marks its …
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EP&Dee are offering you the chance to win an MCP19111 Evaluation Board (ADM00397). The MCP19111 …