Indium Corporation® is set to showcase its advanced metal thermal interface materials (TIMs) for burn-in …
Soldering pastes & materials
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Power applications
Kerafol and X2F Partner to Revolutionize Thermal Solutions for Electronic Devices.
by gabiKerafol and X2F are teaming up to develop state-of-the-art thermal management solutions for electronic devices …
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Soldering pastes & materials
Indium Corporation to Feature Precision Au-Based Die-Attach Preforms at SPIE Photonics West
by gabiIndium Corporation® will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and …
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Soldering pastes & materials
Indium Corporation Introduces New Package-Attach Solder Preform Technology at Productronica
by gabiIndium Corporation® is proud to introduce a novel alloy technology that enables lower processing temperatures …
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Soldering pastes & materials
New Gap Filler Pad from Parker Offers Exceptionally High Thermal Conductivity
by gabiThe Chomerics Division of Parker Hannifin Corporation, the global leader in motion and control technologies, …
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Soldering pastes & materials
Indium Corporation to Feature Precision Au-Based Die-Attach Preforms at International Microwave Symposium
by gabiIndium Corporation® will feature its high-reliability, Au-based precision die-attach (PDA) preforms for critical laser and …
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