Toposens introduces new ultrasonic 3D sensor featuring Infineon’s XENSIV™ MEMS microphone

Analog Devices’ Battery Management IC Delivers Longer Battery Runtime

Microchip Adds Second Development Tool Offering for Designers Using Its Low-Power PolarFire® RISC-V® SoC FPGA for Embedded Vision Applications at the Edge

MicroSys cooperates with EBV Elektronik in EMEA

Computer-on-Modules meet functional safety and security

PLS' UDE supports NXP's new S32K3 MCU family with optimized debug, analysis and test functions

Wound Healing with Plasma

18 NOVEMBER 2021
Power modules
8 NOVEMBER 2021

Point-of-Load DC-to-DC Converters Solve Voltage Accuracy, Efficiency, and Latency Issues