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Renesas’ Radiation Hardened ICs Take Flight on NASA’s...
Anritsu Expand General Purpose Instruments Portfolio via TTi...
Tria Technologies brings multi-OS support to Qualcomm-based hardware
Melexis Enables Fast, Code-Free Three-Phase Fan Design with...
Toshiba launches 40V, 0.67mΩ N-channel MOSFET using latest-generation...
Würth Elektronik introduces heat sinks for power-electronics and...
Authorised Distributor Mouser Electronics Offers Engineers the Latest...
Arrow Electronics Announces New Single Pair Ethernet Reference...
Infineon launches industry first TLVR quad phase module...
XSENS MTi-8 Click from MIKROE provides RTK-enhanced GNSS...
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by donpedro

Renesas’ Radiation Hardened ICs Take Flight on NASA’s Artemis II Crewed Lunar...

2 April 2026

Anritsu Expand General Purpose Instruments Portfolio via TTi Sales Agreement

2 April 2026

Tria Technologies brings multi-OS support to Qualcomm-based hardware

31 March 2026

Melexis Enables Fast, Code-Free Three-Phase Fan Design with Intuitive Motor Driver

31 March 2026

Toshiba launches 40V, 0.67mΩ N-channel MOSFET using latest-generation process technology to enhance...

31 March 2026

Würth Elektronik introduces heat sinks for power-electronics and IC components

31 March 2026

Latest posts

  • Aerospace & Defence

    Renesas’ Radiation Hardened ICs Take Flight on NASA’s Artemis...

    by gabi
    2 April 2026
  • Test & Equipment

    Anritsu Expand General Purpose Instruments Portfolio via TTi Sales...

    by gabi
    2 April 2026
  • Embedded Computing

    Tria Technologies brings multi-OS support to Qualcomm-based hardware

    by gabi
    31 March 2026
  • Automotive/Transportation

    Melexis Enables Fast, Code-Free Three-Phase Fan Design with Intuitive...

    by gabi
    31 March 2026
  • Power devices

    Toshiba launches 40V, 0.67mΩ N-channel MOSFET using latest-generation process...

    by gabi
    31 March 2026
  • Power applications

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    by gabi
    31 March 2026
  • Embedded Computing

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    by gabi
    26 March 2026
  • Design

    Arrow Electronics Announces New Single Pair Ethernet Reference Design...

    by gabi
    26 March 2026
  • Power modules

    Infineon launches industry first TLVR quad phase module exceeding...

    by gabi
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  • Development boards

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  • SoC / SiP / SoM / SBC

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  • Design

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    Wireless modules for embedded systems now available from Tria...

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  • Passive components

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  • Power devices

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XSENS MTi-8 Click from MIKROE provides RTK-enhanced GNSS and inertial navigation system...

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VectorCAST 2026 Launches AI-Powered Requirements-Based Test Creator

19 March 2026
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Siemens expands data center partner ecosystem to scale next-generation AI infrastructure

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Mouser’s Autonomous Vehicle Online Resource Centre Addresses Real-World Deployment Challenges

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Mythic® Selects memBrain™ Technology from Silicon Storage Technology® for its Next Generation...

17 March 2026
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© EURO STANDARD PRESS 2000

Electronica azi International
  • Industries
    • ind1
      • Automotive/Transportation
      • Medical
      • Industrial
      • Lighting
      • Wireless
    • ind2
      • Alternative Energy
      • Test & Equipment
      • Security
      • Robotics / Cobots
      • Aerospace & Defence
    • ind3
  • Products
    • Product1
      • Active components
      • DSPs & DSCs
      • Electronics Components
      • Power devices
      • Power modules
      • Power supplies
      • Actuators
      • AFE
      • Cables/Connecting
      • Electromechanical & networking switches
    • Product2
      • Sensors
      • MEMS Sensors
      • Displays/Opto
      • HMI
      • LEDs
      • Embedded software
      • PCB
      • Passive components
      • Soldering pastes & materials
      • Equipment
    • Product3
      • Communications
      • Cybersecurity
      • Wearables
      • IO-Link
      • RF
      • PLCs
      • X-Ray
      • Storage
      • Transformers
      • Interconnect and Communication Devices
  • Technologies
  • Embedded Systems
  • Applications
  • Magazine Archive (PDF)

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