Toposens introduces new ultrasonic 3D sensor featuring Infineon’s XENSIV™ MEMS microphone

Analog Devices’ Battery Management IC Delivers Longer Battery Runtime

Microchip Adds Second Development Tool Offering for Designers Using Its Low-Power PolarFire® RISC-V® SoC FPGA for Embedded Vision Applications at the Edge

MicroSys cooperates with EBV Elektronik in EMEA

Computer-on-Modules meet functional safety and security

PLS' UDE supports NXP's new S32K3 MCU family with optimized debug, analysis and test functions

Wound Healing with Plasma

18 NOVEMBER 2021
Power modules

Point-of-Load DC-to-DC Converters Solve Voltage Accuracy, Efficiency, and Latency Issues