Indium Corporation will feature selections from its portfolio of high-reliability solutions for power electronics at the International Conference on Integrated Power Electronics (CIPS), March 15-17 in Berlin, Germany.
Indium Corporation is the leader in power electronics assembly materials as a variety of industries—including automotive, transportation, computing, and energy infrastructure—demand more from power electronics systems. Indium Corporation continues to deliver proven high-reliability material solutions to current and emerging power electronics challenges.
Indium Corporation’s InFORMS® solder preforms do more than just bond two surfaces—they are designed to address specific challenges for the power electronics industry. InFORMS® are a composite solder material with a reinforcing matrix. This results in:
- Uniform bondline thickness
- Improved mechanical and thermal reliability
- Drop-in alternative to traditional preforms leveraging proven processes
InFORMS® provide engineers with an enhanced material for the development of more reliable and higher performance modules. Due to the planarity improvements and stand-off tolerances, the package design becomes more predictable. In addition, stronger and more dependable joints allow for high power densities.
For more information, visit Indium Corporation’s experts at the show.