Microchip announces from the Embedded World conference in Germany a new family of 8-bit PIC® …
-
-
Digi International announced ConnectCore® 6, the world’s first surface mount multi-chip module with built-in wireless …
-
Embedded ComputingEmbedded Systems
Lattice Semiconductor Expedites & Simplifies USB Type-C Implementation in Consumer and Industrial Devices
Lattice Semiconductor Corporation, the leader in ultra-low power, small form factor, customizable solutions, today announced …
-
Digi International announced the launch of the XBee® ZigBee Cloud Kit, a new all-in-one kit …
-
Embedded ComputingEmbedded Systems
New PowerVR G6020 GPU targets ultra-affordable mobile and IoT devices
March 2, 2015 in Multimedia, PowerVR Developers, PowerVR Graphics Even though most headlines at MWC …
-
Power modules are the way to go when it comes to leveraging the expertise of …
-
Power devicesPower modules
Developing advanced packaging to meet increased needs for higher power density in power modules
Increased processing density in high-end data server designs with the cramming of more and more …
-
32-bit MCUsFreescaleMicrocontrollersProducers
Kinetis Mini MCUs Wafer-Level Chip-Scale Package Portfolio
Driving innovation with tiny, industry-leading packages. Overview Kinetis mini MCUs are Freescale’s smallest, ARM Powered® …
-
Maxim IntegratedPower applicationsPower devicesProducers
Maxim Integrated Demonstrated Highly Integrated Analog Solutions at Embedded World 2015
Maxim Integrated Products, Inc. demonstrated highly integrated analog solutions for embedded applications at the Embedded …
-
This document provides guidelines to use the Wafer Level Chip Scale Package (WLCSP) to ensure …