Altera Corporation disclosed the industry’s first heterogeneous System-in-Package (SiP) devices that integrate stacked High-Bandwidth Memory (HBM2) from SK Hynix with high-performance Stratix® 10 FPGAs and SoCs. Stratix 10 DRAM SiP represents a new class of devices that is specifically architected to meet the most demanding memory bandwidth requirements in high-performance systems. Stratix 10 DRAM SiP […]