UTAC Successfully Qualifies a 9mm x 8mm Automotive Grade iBGA Package

by donpedro

UTAC Holdings Ltd. (“UTAC”), a global semiconductor test and assembly services provider, has successfully qualified a CMOS image sensor using a 9.0 mm x 8.0 mm iBGA package to the demanding AEC-Q100 Grade 2 standard for one of its key customers.

Meeting the AEC-Q100 standard is very challenging as the package needs to meet stringent requirements on reliability, safety and quality. During the qualification, devices are subjected to elevated temperature and humidity, temperature cycling and high-temperature operation. Internal wire bonds in the devices are required to endure pull testing to confirm their integrity.

“Our engineers work closely with customers worldwide to ensure our packaging and test programs are optimized, enabling qualification in a stringent and demanding environment,” said Dr John Nelson, President & CEO of UTAC. “Among full-service assembly and test providers, our test percentage of revenue is one of the highest in the industry.” Dr Nelson continued.

According to a recent report by Yole Developpement (www.yole.fr), the automotive image sensor market was worth in excess of $1,440M in 2020 and is expected to grow 13% CAGR for the next 5 years, significantly outpacing the growth of image sensors in other applications. Image sensing is an important growth market globally with the devices being embedded in smartphones and tablets as well as being used for medical, security and industrial applications. In the automotive sector, almost all modern vehicles now contain several image sensors for safety applications such as object detection, 360-degree view, black box cameras, traffic sign recognition, reversing cameras, driver monitoring etc.


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