Molex, a global electronics leader and connectivity innovator, today announced the results of a global …
Products
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Passive components
Pioneering Resin Molding MLCCs from Murata Attain the Creepage Distance Needed by High-Volt EV Powertrains While Still Supporting System Miniaturisation
by gabiLeading electronics manufacturer Murata has today introduced multi-layer ceramic capacitor (MLCC) products that successfully draw …
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Power modules
Flex Power Modules boosts quarter brick DC/DC power rating to 1600 W continuous, 2320 W peak
by gabiFlex Power Modules introduces a new device to their range of quarter brick non-isolated DC/DC …
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Passive components
The X1, X2 and Y2 film capacitors of the F340 series from Vishay at Rutronik
by gabiRutronik expands its portfolio with the latest X1, X2, and Y2 film capacitors from Vishay …
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Power devices
New application interface boards from Cambridge GaN devices enable users to try iceGaN ICs in Existing designs without pcb re-layout
by gabiCambridge GaN Devices (CGD), the fabless, clean-tech semiconductor company that develops a range of energy-efficient …
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eSOL, a global specialist in the development of real-time embedded software solutions, has extended its …
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MEMS Sensors
Bota Systems unveils miniature 6-axis force-torque sensor to elevate robotics performance
by gabiBota Systems, a pioneer in multi-axis force-torque sensors, has launched its smallest sensor yet, the …
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Cables/Connecting
Molex Unveils First-to-Market, Chip-to-Chip 224G Product Portfolio to Accelerate Support for Next-Gen Data Centers & Generative AI Applications
by gabiMolex, a global electronics leader and connectivity innovator, has introduced the industry’s first chip-to-chip 224G …
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IoT applications
New at Mouser: TE Connectivity/Laird 5G Phantom No Ground Plane Required Antennas for IoT Applications
by gabiMouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, is …