Indium Corporation will feature the award-winning Durafuse™ LT–the novel, low-temperature alloy system designed to provide high-reliability in low-temperature applications–during Productronica China, held March 17-19 in Shanghai, China.
Durafuse™ LT is one of several products in Indium Corporation’s wide portfolio that meet the evolving needs of mobile and computing applications.
Patent-pending Durafuse™ LT is designed to provide high-reliability in low-temperature applications that need to reflow below 210°C. Where traditional low-temperature solders can produce brittle solder joints that are susceptible to drop shock failures, Durafuse™ LT provides superior drop shock resilience, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup.
- Provides a solution for heat-sensitive components and flex polymers
- Prevents thermal warpage of processor components and multilayer boards
- Meets low-temperature requirements for step soldering, particularly in RF shield attachment, post underfill processes, and rework applications
From paste to wire, flux, and preforms, Durafuse™ LT joins a long list of Indium Corporation’s products that are specifically engineered to support the challenges of automotive electrification.
For more information about Indium Corporation’s Durafuse™ LT, visit its show booth at E4.4100.