Several Indium Corporation technical experts will share their knowledge at the IPC APEX Expo, Feb. 1-6, in San Diego, Calif., USA.
The following technical papers from Indium Corporation experts will be featured:
- Novel TIM Solution with Chain Network Solder Composite by Dr. Ning-Cheng Lee, Vice President of Technology
- Enhanced Cleanability Using Fluxes with Decreased Viscosity After Reflow by Dr. Lee
- Can a PCBA with a Modern No-Clean Solder Paste Flux Residue Offer Electrical Reliability Comparable to a Cleaned PCBA? by Kim Flanagan, Technical Support Engineer
- Optimizing the Robotic Soldering Process by Robert McKerrow, Product Specialist
Additionally, Claire Hotvedt, Product Development Specialist, will present her poster, Durafuse™ LT–A Mixed Alloy Solution for Low-Temperature Drop Shock.
Miloš Lazić, Technical Support Engineer, will moderate the technical conference session S05: Advances in Dispensing.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.