The Chomerics Division of Parker Hannifin Corporation, the global leader in motion and control technologies, is releasing THERM-A-FORM™ CIP 60, a high-performance cure-in-place material and thermal gap filler that offers excellent 6.0 W/m-K thermal conductivity. This innovative product not only provides an attractive alternative to hard-curing dispensable materials in electronics cooling applications, but also offers an improvement over standard application methods associated with thermal gap filler pads.
As a two-component dispensable material, THERM-A-FORM CIP 60 has an exceptional flow rate and is dispensable in high volumes. With a 1:1 mix ratio, the material offers easy dispensing through a static mixing tip using either manual or automated equipment. THERM-A-FORM CIP 60, which also has vibration damping characteristics to meet the demands of challenging operating conditions, requires no pre-mixing or weighing of components.
The product is particularly suitable as a thermal fill material in applications that need heat transfer in challenging or irregular geometries, such as cooling multi-height components on a printed circuit board (PCB) without excessive force. Design engineers can thus avoid the expense of a moulded sheet.
THERM-A-FORM CIP 60 resists sag when curing, a process that takes 60 minutes at 110°C or 24 hours at 25°C. At full cure, the product has a Shore hardness of 50 (according to ASTM 2240 test method) and can operate in temperatures from -50°C to +200°C.
Offering a blend of high thermal conductivity, flexibility and ease-of-use, applications for this RoHS-compliant product include: automotive e-mobility systems such as converters and inverters; automotive infotainment systems like panel displays, HUD (head-up display) units and audio equipment; automotive ADAS (advanced driver assistance systems) encompassing DCU (domain control units), camera systems and radar/lidar systems; and consumer and enterprise SSDs (solid-state drives).
The formulation of THERM-A-FORM CIP 60 brings advantages to modern high-performance, high-reliability electronics with properties that include: 125 kVac/mm dielectric strength (ASTM D149 test method); 1013 Ωcm volume resistivity (ASTM D257); 69.3 dielectric constant at 1,000 KHz (ASTM D150); and 0.006 dissipation factor at 1,000 kHz (CHO-TM-TP13).
THERM-A-FORM CIP is available in ready-to-use, dual-component cartridge systems (50, 200 and 400cc) that eliminate the need for weighing, mixing and degassing.
Learn more about THERM-A-FORM CIP 60 here.