Laird announced the release of its BTM46x Series Bluetooth® modules. Mass production quantities of modules and the associated development kits are now available directly from Laird.
Based on the market-leading Cambridge Silicon Radio (CSR) BC04 chipset, the innovative firmware on the BTM46x series allows OEMs to seamlessly support Bluetooth data connectivity for all PCs, smartphones and tablets including Apple iOS devices. The BTM46x firmware enables Apple licensees
to leverage Bluetooth data connectivity, via the iAP protocol, into their MFI accessories, enabling rapid time to market for their products.
“With Laird’s BTM46x modules and associated development kit, OEMs can provide cross platform Bluetooth data support in a simple and easy to use module,” said Jonathan Kaye, Laird product manager. “Laird’s embedded firmware provides a seamless data connectivity engine regardless of whether connecting to, or from, Bluetooth enabled Android, Windows, Linux or iOS devices.”
Key application areas for the BTM46x Series include medical devices, ePOS terminals, barcode scanners, industrial cable replacement, and smartphone/tablet ‘Appcessories’. Every BTM46x Series module is designed to add robust, short-range Bluetooth data connectivity to any device. With a compact footprint of 12.5 × 22 mm, the modules deliver maximum range with minimum size. The modules are designed to support a separate power supply for I/O, in addition to including a complete Bluetooth v2.1 protocol stack for increased ease of integration.
The BTM46x Series provides support for multi-point connections and includes the following Bluetooth profiles: Serial Port Profile (SPP), HID (Human Interface Device) and Apple’s iAP protocol. BTM46x modules are fully qualified as a Bluetooth End Product, whilst also holding FCC Modular, IC, CE and MIC (Japan) regulatory approvals, enabling designers to quickly integrate the modules into devices without the need for additional qualification resources. The available low-cost developer’s kit makes it easy for an OEM to integrate the module and guarantees the fastest route to prototype and then mass production.