Indium Corporation has released m2TIMTM — a new unique solid/liquid hybrid thermal interface material designed to provide ultra-reliable thermal conductivity for heat dissipation.
Indium Corporation’s m2TIMTM combines liquid metal with a solid metal preform. The presence of a solid solder preform absorbs and contains the liquid alloys while improving thermal conductivity.
Other m2TIMTM benefits include:
- Availability in a variety of alloys, including InGa and InGaSn
- Extraordinary wetting ability to both metallic and non-metallic surfaces
- Extremely low interfacial resistance at surfaces
- Eliminated risk of pump-out of the liquid alloy due to absorption by solid solder preforms
For more information about Indium Corporation’s line of thermal interface materials (TIM) products, visit www.indium.com/TIM.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
Indium Corporation | www.indium.com