Ziehl-Abegg investing 36 million euros on a modern production facility in Germany
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Power devicesPower modulesProducersToshiba
Toshiba launches low-spike-type 40V, N-channel power MOSFET
New MOSFET reduces EMI in switching power supply application
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IndustriesKeysightPico TechnologyProducersRohde & SchwarzTektronixTest & Equipment
Farnell launches new global podcast ‘The Innovation Experts’
Series 1 of The Innovation Experts podcast shares the views of the world’s leading industry …
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Artificial intelligenceDesignEmbedded SystemsPower applicationsPower devicesPower modulesProducersRenesas
New Highly Integrated Renesas PMIC Optimized For RZ/G2L And V2L MPUs Delivers Complete Power Solution To Reduce Design Time
New Device Increases System Reliability; Supports Low-Cost, Four-Layer PCB Boards
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Embedded ComputingEmbedded SystemsIndustrialIndustriesIndustry 4.0IoTIoT applicationsKontronMedicalProducersSoC / SiP / SoM / SBC
New Kontron COM Express® Basic Module with 11th Gen Intel® Core™ and Xeon® W processors for Intelligent Edge Computing
Kontron’s COMe-bTL6 (E2) Computer-on-Module offers up to 8 cores and supports four independent 4K displays …
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5GActive componentsElectronics ComponentsIoTNexperiaPower devicesPower modulesProducers
Nexperia’s new Application-Specific MOSFETs (ASFETs) for hot-swap increase SOA by 166% and slash PCB footprint by 80%
New 80V & 100V devices minimize derating and improve current sharing for optimum performance, high …
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congatecEmbedded ComputingEmbedded SystemsIndustrialIndustriesIoTIoT applicationsLightingMedicalProducers
Leading edge, in more than just bandwidth
congatec sets a new benchmark with the launch of 20 new Computer-on-Modules with 11th Gen …
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Development boardsEmbedded SystemsIndustriesMEMS SensorsPosifa TechnologiesProducersProductsSensorsTest & Equipment
Posifa Technologies Launches New MEMS Pirani Vacuum Transducer Evaluation Kit
PVC4000EVK Eval Kit Allows Vacuum Gauge OEMs to Quickly Test Drive Digital Vacuum Sensing Technology
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Embedded softwareeSync™ AllianceProducersProducts
eSync Alliance accelerates automotive OTA development with an SDK for member companies
New development tool facilitates integration of edge devices into a standardized OTA platform
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Aerospace & DefenceAutomotive/TransportationEmbedded SystemsFPGAsIndustrialIndustriesIndustry 4.0Microchip TechnologyMicrosemiPower devicesPower modulesProducersSecurity
First Aerospace-qualified Baseless Power Module Family Improves Aircraft Electrical System Efficiency
Microchip’s BL1, BL2 and BL3 family, developed with the Clean Sky consortium, is qualified to …