The 3.5″ embedded board PD11TGS from ICP Germany is equipped with the latest Tiger Lake processor generation from Intel®. The Tiger Lake UP platform promises to be energy efficient and responsive and has been created specifically for IoT applications. Short latency through Intel® Time Coordinated Computing, an improved graphics unit, AI acceleration functionality through Intel® Deep Learning Boost and, in combination of CPU and GPU, excellent overall computing performance, are just a few advantages of the 11th Intel® generation. The PD11TGS comes standard with the Intel Core i3-1115G4E 2-core processor with a configurable Thermal Design Power (TDP) of 12 to 28 watts.
The base processor clock varies between 1.7 GHz and 3.0 GHz depending on the TDP setting and reaches a maximum turbo clock of 3.9 GHz. Optionally, variants like the Intel® Celeron® 6305E with 2 CPU cores, the Intel® Core i5-1145G7E or the Intel® Core i7-1185G7E with four CPU cores can be used. A DDR4 SO-DIMM socket allows all boards to use up to 32GB of non-ECC RAM with a maximum clock frequency of up to 3200 MHz. The integrated Intel® HD graphics unit of the 11th generation offers quad display support. Two HDMI ports with a resolution of up to 4096×2160 pixels, one display port with a maximum of 5120×3200 pixels and one LVDS port with a full HD 1920×1200 pixel resolution are available for connecting displays. Optionally, the LVDS port can be replaced by an eDP port with 5120×3200 pixel resolution.
Furthermore, all PD11TGS have one 2.5 Gigabit Ethernet port with I225LM network IC and one Intel® 1Gigabit Ethernet port with Intel® I219-LM IC, four USB 3.1 (Generation 2), two USB 2.0, one SATA-6G port, three serial RS-232, one serial RS-232/422/485 as well as audio MIC-In and LINE-Out interfaces. In addition, an M.2 2242/2280/3042/3052 B-Key and an M.2 2230 slot with E-Key are available for expansion. A NANO-SIM slot enables the use of optional 5G modules. The PD11TGS can be operated in a voltage range of 8 to 24 volts DC and, depending on the selected TDP, in a temperature range of 0 to 60 °C. Upon customer request, ICP also delivers the PD11TGS as a bundle with industrial RAM and storage medium.
3.5″ embedded board with Tiger-Lake UP3 processors
Specifications
- 3.5″ form factor
- Intel® Tiger-Lake UP3
- Intel® Celeron® Core i3/i5/i7
- Max. 32GB DDR4 SO-DIMM memory
- Quadrupple Display Support
- M.2 3052, M.2 2230,
- 2.5 GbE+GbE, USB3.1, HDMI, DP, LVDS/eDP, RS-232
Applications
- Panel PC and embedded systems
- IoT
- edge computing
- Compact PC systems
- Industrial PC Systems
- Image and Video Processing