To meet the increasing market demand for hybrid I/O connectors, TE Connectivity (TE) has introduced a 0.6 mm CL (centerline) high speed CHAMP docking series connector.
The docking series connector is designed for high-density, low-profile (3.8 mm) shield applications featuring two rows of contacts on a 0.6 mm pitch centerline. Contacts on a 0.6 mm centerline can save 30% linear board space and the 3.8 mm low-profile housing reduces connector height by approximately 25%. Multiple options are available including right-angle receptacles, right-angle offset receptacles, and vertical plugs for both dock and cable applications.
TE’s 0.6mm CL high speed CHAMP docking series connector is designed to meet various industry transmission standards including USB 3.0, HDMI (high definition multimedia interface) 1.4 and DisplayPort 1.2.
The product can be applied in such industries as PC (including laptops and tablets) and mobile devices.
For more information on TE’s 0.6 mm CL high speed CHAMP docking series connector, please visit: ww.te.com/products/pcdocking-pr.
TE Connectivity
www.te.com