SMART Modular Launches DDR4-3200 32GB Low Profile Industrial Mini-DIMMs

by donpedro

SMART Modular Technologies, Inc., a subsidiary of SMART Global Holdings, Inc. and a leader in specialty memory, storage and hybrid solutions, including memory modules, Flash memory cards and other solid state storage products, today announced its lineup of DDR4-3200 32GB Low Profile industrial Mini-DIMMs. SMART has several new 32GB Mini-DIMMs which include ULP (Ultra Low Profile) and VLP (Very Low Profile) with registered and unbuffered ECC options to meet a wide range of use cases. SMART has been providing Mini-DIMM support for many years, offering customers long-term support as well as a solid roadmap of new higher-density, higher-speed options.

SMART’s DDR4-3200 32GB industrial Mini-DIMMs undergo stringent in-house environmental temperature screening to operate between -40°C to +85°C which makes SMART’s DDR4 Mini-DIMMs an ideal solution for telecom and networking equipment being deployed under harsh operating conditions. Customized ruggedizing features can be added, such as conformal coating and anti-sulfur resistors to protect against toxic operating conditions or underfill for excessive vibration, all to allow reliable, long-term system operation.

DDR4 Mini-DIMMs are designed with more power and ground pins compared to SO-DIMMs. Mini-DIMMs are JEDEC-standard, an industry standard which SMART originally helped to develop.  The extra power and ground pins ensure robust system operation under harsh conditions.  Systems with Mini-DIMMs often go through NEBS compliance testing, ensuring conformance of a network product to the requirements of the Network Equipment Building System (NEBS) standard. Compliance to this standard indicates that a network product or telecommunications equipment performs at its optimum capacity.

SMART’s high-density industrial Mini-DIMM are offered in ULP height (17.78mm) and VLP height (18.75mm) to accommodate a wide variety of system board height requirements. Mini-DIMMs are supported by connectors from Molex and Foxconn, allowing Mini-DIMMs to be either mounted vertically, angled at 22.5°, or at a right angle to the system board.

They also have robust latching mechanisms designed for a seven or more year product lifecycle. Mini-DIMMs are one of the most versatile memory solutions being used today for leading-edge telecom and networking applications.

These new Mini-DIMMs add to an already robust product family line-up of DDR4 Mini-DIMMs offered by SMART.  For more information please contact SMART Modular Technologies (

SMART will be showcasing its line of Specialty Memory solutions at Embedded World Exhibition and Conference 2020 from February 25-27 at the Nuremberg Messe in Germany. SMART’s stand is located in Hall 2, stand 2-555. Attendees are encouraged to visit the stand to learn about SMART’s full line of Specialty Memory products for the embedded industry.

SMART Modular Technologies

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