From 6 – 8 April 2022, Rehm participated at one of the most important Korean trade fairs at the Suwon Convention Centre and presented the latest equipment and system technology from the fields of reflow soldering with convection and condensation in combination with vacuum processes.
Smart SMT & PCB Assembly (SSPA) took place at the Suwon Convention Center, a central location for the electronics industry. With 200 exhibitors and around 12,000 visitors, it is one of the most important trade fairs in Korea for electronics manufacturing. In addition to numerous exhibitors from the fields of SMT manufacturing, semiconductor equipment, automation solutions for production and software, visitors had a conference programme with expert presentations on the latest trends in electronics manufacturing. At stand E110 on 1st floor, we presented the VisonXP+ VAC reflow convection soldering system and the CondensoXC vapour phase soldering system. Our team on site was happy to advise the visitors!
VisionXP+ VAC: The innovative system for reflow convection soldering with vacuum module is now even more efficient! At NEPCON Korea, Rehm presented the highlights of the VisionXP+, e.g. the use of new EC fan motors, which are not only quieter and more sustainable, but also enable comprehensive operating data recording, a more powerful cooling section and optimisations in the design. The vacuum module ensures void-free soldering and thus reliable assemblies for the most demanding applications.
CondensoXC: The CondensoXC vapour phase soldering system is compact in design and large in performance thanks to the innovative process chamber. The patented injection principle feeds exactly the right amount of Galden® into the process for optimum profiling. Almost 100 % of the medium can be recovered and filtered via the closed-loop filter system. The system is fully vacuum-compatible and has an integrated process recorder – for optimal traceability.