Continental will be collaborating with Infineon Technologies AG in the development of server-based vehicle architectures. …
Infineon
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IoT applications
New NFC tag-side controller from Infineon integrates sensing and energy-harvesting to enable compact, battery-free smart sensing IoT solutions
NFC-based sensing controllers with energy-harvesting capabilities are critical for the development of passive smart devices …
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32-bit MCUs
High-voltage MCU with USB-C PD and buck-boost charging controller, streamlining embedded system design
USB-C has been widely adopted as the connector of choice in the consumer electronics industry …
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32-bit MCUs
Automotive Safety and Cybersecurity: Infineon’s AURIX™ TC3xx, TC4x, TRAVEO™ T2G & PSoC families of microcontrollers support Rust
The Rust programming language, with its built-in support for memory-safe software development, is an important …
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Wireless
Infineon AIROC™ CYW43022 Wi-Fi 5 and Bluetooth® combo extends battery-life for IoT applications with up to 65 percent power reduction
Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced the new AIROC™ CYW43022 ultra-low …
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Power factor correction (PFC) plus LCC resonant topology for constant current output has proven to …
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Security
Infineon’s latest SLC38 security device and TrustSEC’s operating system BIO-SLCOS provide secured, open platform for advanced smart card applications
In cooperation with Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), TrustSEC, a leader in …
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Companies
“Driving decarbonization and digitalization. Together.”: At MWC 2023 Infineon is showcasing its latest semiconductor technologies for a comfier and greener IoT
IoT technologies have the potential to overcome many of the challenges society faces today. Even …
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Development & add-on boards
Infineon’s XENSIV Connected Sensor Kits, Now at Mouser, Offer Sensor Platform for IoT Device Development
Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection …
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Power modules
Infineon QDPAK and DDPAK top-side cooling packages registered as JEDEC standard for high-power applications
The trends toward higher power density and cost optimization dominate the development goals of efficient …
