Ultrasonic DIE bonding is a fast, clean and efficient technology increasingly utilized in the semiconductor …
Industries
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Power devices
CCPAK1212 package pushes the performance of Nexperia’s power MOSFETs to the next level
by gabiNexperia announced the launch of 16 new 80 V and 100 V power MOSFETs in …
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Test & Equipment
Tektronix Announces Special Pricing and Extended 5-Year Total Protection on Select Oscilloscopes, Exclusively for Educators
by gabiTektronix, Inc., a global leader in test and measurement solutions, is excited to announce special …
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Automotive/Transportation
Mouser Spotlights Automotive Zonal Architecture in New eBook from TE Connectivity and Microchip Technology
by gabiMouser Electronics, Inc., the authorised global distributor with the newest electronic components and industrial automation …
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Power supplies
Advanced Energy Expands Range of Ultra-High Power Density Configurable Power Supplies for Industrial and Medical Applications
by gabiAdvanced Energy – a global leader in highly engineered, precision power conversion, measurement and control …
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Power devices
Nexperia launches miniaturized leadless logic ICs to save space and enhance reliability in automotive applications
by gabiNexperia introduced a new portfolio of logic ICs in tiny automotive-qualified MicroPak XSON5 leadless packaging. …
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Murata will introduce a selection of its next-generation technologies at CES 2025 (7th – 10th …
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Development boards
Mouser Delivers Nordic Semiconductor nRF9151-DK Development Kit for Global LTE, Smart, and IoT Applications
by gabiMouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation …