Alphawave Semi, a global leader in high-speed connectivity and compute silicon for the world’s technology …
Manufacturing and Materials
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SECO has announced its comprehensive Solution for Embedded Payments, a turnkey solution designed to simplify …
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Soldering pastes & materials
New Two-Component Thermal Gap Filler and CIP Material (THERM-A-GAP™ CIP 35E) Simplify Application Process
The Chomerics Division of Parker Hannifin Corporation, the global leader in motion and control technologies, …
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The innovative EO-M-026 flux is a ready-to-use, highly concentrated special flux that has been developed …
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Passive components
Murata Launches World’s First High-Frequency Filter Using XBAR Technology for 5G, Wi-Fi 7, and Future 6G Networks
Murata Manufacturing Co., Ltd. has announced the mass production and commercial shipment of the world’s …
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The non-profit industry organization COGD (Component Obsolescence Group Deutschland) e.V. recently celebrated its 20th anniversary. …
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Companies
Infineon advances on 300-millimeter GaN manufacturing roadmap as leading Integrated Device Manufacturer (IDM)
As the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is …
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SoC / SiP / SoM / SBC / CoM
Alphawave Semi Tapes Out Breakthrough 36G UCIe™ IP on TSMC 2nm, Unlocking Foundational AI Platform IP on Nanosheet Processes
Alphawave Semi, a global leader in high-speed connectivity and compute silicon for the world’s technology …
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Time is running out to enter the 2025 Create the Future Design Contest, an exciting …
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Manufacturing and Materials
Siemens expands OSAT Alliance membership to build domestic semiconductor supply chains
Siemens Digital Industries Software announced today the latest members to join its OSAT Alliance program …
