The requirements for THT assembly are constantly increasing. Short set-up times, maximum process reliability and …
Manufacturing and Materials
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Manufacturing and Materials
Alphawave Semi Taped-Out Industry Leading 64Gbps UCIe™ IP on TSMC 3nm for the IP Ecosystem, Unleashing Next Generation of AI Chiplet Connectivity
Alphawave Semi, a global leader in high-speed connectivity and compute silicon for the world’s technology …
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Manufacturing and Materials
Siemens collaborates with TSMC to accelerate 3D IC and AI-driven circuit and systems design
Today at the 2025 TSMC North America Open Innovation Platform® (OIP) Ecosystem Forum, Siemens Digital …
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Design
Mouser Electronics Explores the 3D Printing Revolution and Its Impact on Design, Engineering, and Manufacturing
Mouser Electronics, Inc., the authorised global distributor with the newest electronic components and industrial automation …
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Design
Alphawave Semi Highlights Why the Next Generation of AI Advances Demand Chiplet Architectures at EE Times: The Future of Chiplets
Alphawave Semi, a global leader in high-speed connectivity and compute silicon for the world’s technology …
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SECO has announced its comprehensive Solution for Embedded Payments, a turnkey solution designed to simplify …
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Soldering pastes & materials
New Two-Component Thermal Gap Filler and CIP Material (THERM-A-GAP™ CIP 35E) Simplify Application Process
The Chomerics Division of Parker Hannifin Corporation, the global leader in motion and control technologies, …
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The innovative EO-M-026 flux is a ready-to-use, highly concentrated special flux that has been developed …
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Passive components
Murata Launches World’s First High-Frequency Filter Using XBAR Technology for 5G, Wi-Fi 7, and Future 6G Networks
Murata Manufacturing Co., Ltd. has announced the mass production and commercial shipment of the world’s …
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The non-profit industry organization COGD (Component Obsolescence Group Deutschland) e.V. recently celebrated its 20th anniversary. …