Indium Corporation’s Kim Flanagan, Technical Support Engineer, will host a reliability webinar as part of Indium Corporation’s new webinar series on Webex at 11 a.m. April 28.
Kim Flanagan
Indium Corporation’s InSIDER Series is a free program designed to deliver expert technical content, share industry knowledge, and promote professional growth using a virtual platform. Current and future webinars can be found at http://www.indium.com/webinar.
Why does a D-PAK exhibit more voiding than other types of bottom termination components (BTCs)? In D-PAK Voiding: A Study to Determine the Origins of D-PAK Voiding, Flanagan will review voiding results based on an analysis of several process variables, such as adding weight to the top and cutting off the leads of a D-PAK, giving insight into the physics behind D-PAK voiding, and providing an answer to the root cause. Her goal is to help identify the root cause of the phenomenon. A live Q&A session will immediately follow her presentation.
Flanagan provides technical support and guidance on process steps, equipment, techniques, and materials to customers. In addition, she provides technical training to staff and industry partners. Flanagan began her career with Indium Corporation through the company’s summer college internship program, working in the Quality Department. She remained with Indium Corporation as a part-time Quality Engineering Technician while she finished her bachelor’s degree in physics at Le Moyne College in Syracuse. She joined the technical support team in January 2017.
To register for Flanagan’s webinar, visit www.indium.com/webinar. The webinar link will be shared with registrants the day of the event. Registrants must use a company email account in order to avoid Indium Corporation’s spam filters. This is a first come, first-served event.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, India, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.