congatec welcomes official release of the COM Express 3.0 specification

by donpedro

conga-B7XD-(1)congatec – a leading technology company for embedded computer modules, single board computers and embedded design and manufacturing services, and editor of various Computer-on-Module specifications – welcomes the PICMG release of the COM Express 3.0 specification. The revision 3.0 of the specification formally integrates the new Type 7 pinout type which is the basis for congatec’s Server-on-Modules. The official release fires the starting shot for the race to a new generation of server designs based on standardized Server-on-Modules. These products enable the most cost efficient server designs and performance upgrades across all existing and upcoming generations of server class processors and sockets from any vendor. Modular server designs can be started instantly as modules, carrier boards, starter kits, design guides and circuit schematics are readily available.

Server-on-Modules are also an excellent fit for all the various embedded and IoT server designs in harsh industrial environments where space is restricted and dedicated high-bandwidth interfaces are essential to connect the various controls in the industry 4.0 fields. Here, Server-on-Modules can massively improve design efficiency. This is of major significance for embedded design engineers as recent studies report that they are facing the challenge to constantly manage more projects within a given or even shorter time frame, leading to massive time pressure for executing each project. Server-on-Modules can deliver the vital design efficiency improvements by providing an application ready server core instead of only a hand full of individual components.
COM Express Type 7 Server-on-Modules, carrier boards and starter kits can be requested by customers for the evaluation of the new generation of modules.

congatec AG    |    www.congatec.com

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