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Home Embedded Systems Embedded Computing Toposens

Toposens introduces new ultrasonic 3D sensor featuring Infineon’s XENSIV™ MEMS microphone

12 NOVEMBER 2021

Toposens has partnered up with Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) to realize 3D obstacle detection and collision avoidance in autonomous systems using Toposens’ proprietary 3D ultrasound technology. The Munich-based sensor manufacturer offers 3D ultrasonic sensors ECHO ONE DK that leverage sound, machine vision, and advanced algorithms to enable robust, cost-effective and accurate […]

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