AVX Corporation, offers the lowest profile 0603 and 0805 multilayer organic (MLO™) diplexers available in the global market. Compared to equivalent low temperature co-fired ceramic (LTCC) products, AVX’s 0603 and 0805 MLO diplexers exhibit superior attenuation, low insertion losses, low parasitics, high heat dissipation, and excellent solderability. Ideally suited for band switching in dual and multiband systems, such as WiFi and WiMax (WLAN/BT); mobile telecommunications, including 3G and 4G LTE (WCDMA, CDMA, and GSM); and GPS, the 0603 and 0805 MLO diplexers measure a scant 0.42mm (0.017”) and 0.55mm (0.021”) in height, respectively. Based on AVX’s patented multilayer organic high density interconnect technology, the 0603 and 0805 MLO diplexers employ high dielectric constant and low loss materials to realize high Q passive printed elements, such as inductors and capacitors in multilayer stack ups. Expansion-matched to PCBs, the devices also provide improved reliability compared to ceramic and silicon components.