Titanium solder mask technology from Eutect for precision and process stability in modern selective soldering
At this year’s productronica in Munich, Eutect GmbH will present its latest generation of titanium solder masks for selective soldering. The custom-made masks are developed in-house at the company’s technical center together with matching solder nozzles. They enable maximum precision, process stability and cost-effectiveness, even for complex assemblies, sensitive geometries and high quantities. This underlines Eutect’s role as an innovative provider of integrated solutions for modern selective soldering processes.
Titanium soldering mask technology
With its specially developed titanium soldering masks and decades of experience in selective soldering, Eutect sets high standards for quality and cost-effectiveness in selective soldering. Specifically selected titanium materials combined with in-house surface treatments ensure solder-repellent, particularly smooth surfaces and minimized heat sinks. Sensitive components and housings are effectively protected, while thin-walled constructions and optimized solder flow ensure improved wetting and high solder penetration. Three-dimensional designs reduce the influence of component tolerances and increase reproducibility. With this development, Eutect offers a practical solution for precise selective soldering processes.
Thanks to customer-specific design and Eutect’s comprehensive process expertise, masks are created that are perfectly tailored to every component and every process through the integration of fixing and holding elements, right through to catch geometries. Eutect’s solder masks are precisely tailored solutions between the assembly, soldering process, and automation. This increases quality and reproducibility, protects sensitive components, reduces consumption, and measurably lowers the costs per solder joint. They can also be seamlessly integrated into non-EUTECT systems. Since the masks are developed in close coordination with solder nozzles and process parameters, these optimized mini-wave and selective soldering processes run stably, reproducibly, and reliably. The results are higher process reliability, high-quality solder joints, minimized material stress, longer service life, reduced costs, and overall increased cost-effectiveness. Eutect not only manufactures soldering masks for its own soldering systems, but also offers them to users of third-party systems.
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“Selective soldering of electronic assemblies is becoming increasingly challenging due to increasing miniaturization, complex geometries, and higher requirements for process reliability and durability. To meet these challenges, we have been relying on customer-specific solder masks developed in-house since 1996,” explains Matthias Fehrenbach, Managing Director of Eutect GmbH. Titanium solder masks precisely control the solder flow on a printed circuit board, limit the solder supply to specific areas, and protect sensitive components. “Our masks are created in our in-house technical center, often in combination with the development of the appropriate solder nozzle, so that end customers receive a complete, optimally coordinated solution for our systems as well as for third-party systems,” Fehrenbach continues.
Composite materials often reach their limits when it comes to complex masking. For example, if assemblies are already mounted in housings and SMD components on the underside are very close to the housing and the THT solder joints to be soldered, walls, separating bars, and connections must be extremely thin and still remain stable in the long term. The same applies to baffles and pressure chambers, which must be manufactured with precision as they perform important functions due to miniaturization. That is why all Eutect masks are made of titanium.
Titanium is indispensable, especially when separator widths of well under a millimeter are required and high durability is expected at the same time. Thanks to its high strength, separator widths of less than 0.5 mm can even be achieved. The metal is also durable and resistant to flux, aggressive cleaning substrates, and other chemical influences. Due to the high process temperatures and process cycles at the customer’s site, the masks are manufactured as solid titanium masks.
The masks can be equipped with additional functions.
If components or connectors need to be aligned or fixed in place, the masks are given specific catch geometries or fixing systems so that all components remain in their intended position. This means that nothing prevents the mask from being transported on an inline system using a workpiece carrier. The mask geometry, hold-down devices, alignment elements, and sliders are determined during the evaluation and project development phase. Fixing systems consisting of spring and latching elements guarantee high functionality, and attention is paid to ensuring that the masks can be loaded and unloaded easily. “The mask is finally adapted by us to the customer’s requirements. Since we are involved in the project from the very beginning, the adaptation is a mere formality. Thanks to this close cooperation, the number of masks produced increases every year,” says Fehrenbach.
Titanium solder masks are therefore much more than just a tool.
They are the key to precise, stable, and economical selective soldering, even for complex assemblies, sensitive geometries, and high quantities. The close integration of mask technology and solder nozzle design, as well as individual additional functions, results in maximum functionality and efficiency, which is reflected in the measurable quality, reliability, and productivity of the soldering processes.
Eutect GmbH will be exhibiting at productronica 2025 in Munich from November 18 to 21, 2025. At booth 439 in Hall B2, Eutect will be presenting innovative solutions for selective soldering, including precision workpiece carriers and soldering masks.