Infineon Technologies and ROHM have signed a Memorandum of Understanding to collaborate on packages for …
Products
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Embedded software
Siemens and ASE collaborate on workflows for ASE’s VIPack advanced packaging platform
by gabiSiemens Digital Industries Software announced that it is collaborating with Advanced Semiconductor Engineering, Inc. (ASE), …
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Manufacturing and Materials
Siemens collaborates with TSMC to accelerate 3D IC and AI-driven circuit and systems design
by gabiToday at the 2025 TSMC North America Open Innovation Platform® (OIP) Ecosystem Forum, Siemens Digital …
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Cables/Connecting
New at Mouser: Samtec Nitrowave RF Cable Assemblies for Aerospace, Computing, and Instrumentation Applications
by gabiMouser Electronics is now shipping the new Nitrowave™ RF cable assemblies from Samtec. Nitrowave RF …
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Test & Equipment
Emerson and Vrije Universiteit Brussel to Develop Wideband Testing for Active Electronically Scanned Arrays
by gabiEmerson announced the signing of an agreement with Vrije Universiteit Brussel (VUB) to advance wideband …
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Embedded software
Vector and Lauterbach Shorten Time to Market for Safety Critical Applications
by gabiVector, leading manufacturer of software tools and components for the development of software-based electronic systems …
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Power applications
Infineon CoolGaN™ technology boosts power performance in network PoE applications of Universal Microelectronics
by gabiInfineon Technologies provides CoolGaN™ power transistors to Universal Microelectronics Co., Ltd. (UMEC) for the company’s …
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Sfera Labs has released the new SuperCaps UPS X2-Series Expansion Board, bringing integrated, supercapacitor-based backup …
