New XH018 transistors improve flicker noise up to a factor of 10 in order to …
Active components
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Active componentsElectronics ComponentsEmbedded ComputingEmbedded SystemsMicrochip TechnologyProducers
Protect IP and deploy secured connected systems with Microchip’s new CryptoAuthentication™ device and Security Design Partner Programme
by donpedroMicrochip announces the ATECC608A CryptoAuthentication™ device, a secure element that allows developers to add hardware-based …
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Active componentsElectronics ComponentsMicrochip TechnologyProducers
USB smart hub ICs enable smartphone-connected automotive infotainment
by donpedroMicrochip announces five new USB 2.0 smart hub ICs: The USB4xxx series devices provide unrivalled …
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Active componentsElectronics Components
Online BOM calculator simplifies costing process for IIoT custom ICs
by donpedroS3 Semiconductors today announced an online bill of materials (BOM) calculator that shows how custom …
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Active componentsElectronics ComponentsPassive components
Rutronik supports Team HCB-Rutronik Racing in the Macau Grand Prix
by donpedroRutronik Elektronische Bauelemente GmbH plans to broaden its business relationships in Asia and become better …
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32-bit MCUsActive componentsElectronics ComponentsEmbedded ComputingEmbedded SystemsMicrocontrollersPower devicesPower modules
Renesas Electronics Announces Company Name Change of Consolidated Subsidiary
by donpedroIntersil Corporation to Change its Name to Renesas Electronics America in January 2018 to Accelerate …
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Active componentsElectronics ComponentsPower devicesPower modulesProducersTexas Instruments
TI enables designers to achieve a new low in standby power
by donpedroLLC controller provides ultra-fast transient response, robust fault protection and the lowest standby power in …
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Active componentsElectronics ComponentsIoTIoT applicationsRF
CML expands RF power amp family with ultra-compact device for 130MHz to 700MHz
by donpedroCMX902 IC combines high gain and high efficiency with small footprint
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Active componentsElectronics ComponentsPower devicesPower modulesProducersToshiba
Toshiba Launches 40V and 60V MOSFETs Based on Latest Generation of Trench Process
by donpedro40V and 60V U-MOS-IX-H series in DPAK package offer extremely low RDS(ON) down to 3.1mΩ
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Active componentsElectronics ComponentsMaxim IntegratedPower devicesPower modulesProducers
Maxim Integrated Empowering Automotive Design Innovation at ELIV 2017
by donpedroAt the international VDI Congress ELIV (Electronics In Vehicles) in Bonn, Germany (October 18-19, 2017), …