META-DX2L enables routers, switches and line cards to double their bandwidth by transitioning to 112G …
Producers
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5GActive componentsArtificial intelligenceCommunicationsCybersecurityElectronics ComponentsEmbedded SystemsIndustriesIoTIoT applicationsMicrochip TechnologyProducersRFWireless
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Active componentsElectronics ComponentsIndustriesIoTIoT applicationsPanasonicProducersWireless
High data rates, low-power operation: New dual-band Wi-Fi 5 and Bluetooth® 5 module PAN9028 guarantees maximum flexible connectivity
by donpedroFollowing the market’s high demand for modules suiting highly integrated applications and rapid certification processes, …
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32-bit MCUsHMIIndustriesIoTIoT applicationsMicrocontrollersPower applicationsPower devicesPower modulesProducersProductsRenesasSecurity
Renesas Launches 32-Bit RX671 MCUs Realizing High Performance and Power Efficiency with HMI Functions for Contactless Operation
by donpedroA Single-Chip Solution for a Wide Range of Needs That Combines Large Memory Capacity and …
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Embedded ComputingEmbedded SystemsIndustrialIndustriesIndustry 4.0IoTIoT applicationsPortwellProducersSoC / SiP / SoM / SBCWireless
Portwell Announces PCOM-B645VGL, a new COM Express® Type 6 Compact Module that Boosts Existing System Performance with the latest Intel Atom® x6000E Series Processor (Codenamed Elkhart Lake)
by donpedroPCOM-B645VGL features -40°C to 85°C wide operating temperature, real-time capability via 2.5 GbE port and …
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Embedded ComputingEmbedded SystemsKontronProducersSoC / SiP / SoM / SBC
Kontron updates its VX305C-40G and VX305H-40G Single Board Computers
by donpedroKontron continues to update its 3U SBCs to introduce new capabilities
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5GActive componentsAETA Audio SystemsDesignElectronics ComponentsEmbedded SystemsIndustriesIoTProducersWireless
AETA Audio Systems Adds 5G to ScoopTeam
by donpedroRepresents a significant leap forward in the world of audio transport
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Active componentsElectronics ComponentsMEMS SensorsPower devicesPower modulesProducersProductsX-FAB
X-FAB Becomes First Foundry to Offer High-Volume Micro-Transfer Printing Capabilities Following Licensing Agreement with X-Celeprint
by donpedroLong-term collaboration, plus major engineering investment, leads to highly cost-effective, scalable, and convenient methodology for …
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DesignDevelopment boardsEmbedded SystemsProducersRenesas
Renesas Reimagines Remote Design With Enhanced Lab on the Cloud Environment
by donpedroCloud-Connected Lab Accelerates Board Configuration with Advanced New GUI and Testing for Voice, Mobile, and …
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AmphenolCables/ConnectingIndustrialIndustriesIndustry 4.0IoTIoT applicationsPower applicationsPower devicesProducersProductsRFSensors
New eBook from Mouser Electronics and Amphenol Explores the Interconnects, Sensors, and Antennas Required for IIoT
by donpedroMouser Electronics, Inc., the authorised global distributor with the newest semiconductors and electronic components, announces …
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Alternative EnergyIndustrialIndustriesIndustry 4.0InfineonPower applicationsPower devicesPower modulesPower suppliesProducers
Flexibility meets increased power density and performance: Infineon enhances 1200 V EconoDUAL™ 3 portfolio with IGBT7 featuring new current ratings
by donpedroInfineon Technologies AG (FSE: IFX / OTCQX: IFNNY) launches new current ratings for its EconoDUAL™ …


