Infineon Technologies AG and Flex, a diversified global manufacturer and new preferred automotive design partner …
Producers
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Embedded Computing
DFI and DEEPX Unveil Revolutionary Edge AI at CES 2025 to Power Smart Cities and Industries
DFI, a global leader in embedded motherboards and industrial computers, will join DEEPX at CES …
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Torex Semiconductor Ltd. has launched a new product in the step-down DC/DC converter lineup, the …
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SoC / SiP / SoM / SBC / CoM
Alphawave Semi Scales UCIe™ to 64 Gbps Enabling over 20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
Alphawave Semi, a global leader in high-speed connectivity and compute silicon for the world’s technology …
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Wireless
Murata’s Type 1SC-NTN Module Achieves Skylo FCC & CE L-Band Certification for Cellular and Non-Terrestrial Network Connectivity
Murata Manufacturing Co., Ltd. announces that its Type 1SC-NTN module has received Skylo FCC and …
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Development & add-on boards
Mosaic Click board from MIKROE delivers global coverage multi-band and multi-constellation tracking ability
Mosaic Click is a compact add-on board for precision navigation and location-based applications from MIKROE, …
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Nordic Semiconductor, a global leader in low power wireless connectivity solutions, will showcase its newly …
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Artificial intelligence
Three new IoT platforms for powerful edge AI solutions: SOM-5000, VAB-5000 and ARTiGO A5000 from VIA – new at Rutronik
For demanding edge AI designs, Rutronik offers a range of new IoT platforms from VIA …
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Passive components
Vishay Intertechnology Precision Thin Film MELF Resistors Reduce Component Counts to Save Space, Simplify Designs, and Lower Costs
Vishay Intertechnology, Inc. introduced an enhanced resistance range for precision versions of its AEC-Q200 qualified …
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Embedded software
Siemens extends Veloce hardware-assisted verification support of EPGM Ethernet to 1.6 Tbps
Siemens Digital Industries Software announced an extension of its Veloce™ hardware-assisted verification platform to support …