After announcing the world’s first 300-millimeter gallium nitride (GaN) power wafer and opening the world’s largest 200-millimeter silicon …
Producers
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Test & Equipment
Anritsu Achieves GCF Validation for Next Generation eCall Test Cases on LTE and 5G
by gabiAnritsu Corporation is proud to announce full support for 5G and LTE Next Generation eCall …
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Automotive/Transportation
NSM211x Series High-Precision AEC-Q100 Current Sensors Eliminate Need for External Isolation Components
by gabiNOVOSENSE Microelectronics, a semiconductor company specializing in high-performance analog and mixed-signal chips, has announced the …
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Cables/Connecting
Harwin Showcases Best-in-Class Support Tools Alongside Latest Connector and EMC Protection Technologies at electronica 2024
by gabiAt electronica 2024 visitors to the Harwin booth (A2.335) will experience first-hand the latest digital …
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Farnell has announced that LattePanda Mu compute module, carrier boards, and starter kit, the latest …
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Embedded Computing
E.E.P.D. presents high performance class embedded NUC SBC based on the AMD Ryzen™ Embedded 8000 series for AI and ML applications
by gabiE.E.P.D., solution partner for customized and standard embedded computer boards and systems based on x86 …
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Power devices
Renesas Collaborates with Intel on Best-in-Class Power Management Solution for New Intel Core Ultra 200V Series Processors
by gabiRenesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced a collaboration with …
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