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As one of the few European companies the HTV subsidiary MAF offers the Packaging or Housing of electronic components.
Besides the sample production of Premold packages and Ceramic packages or the packaging of mass production quantities in standard plastic packages special packages for specific applications, for example, also with several Dice or in transparent packages, can be developed and produced as well.
Products and Services at a glance:
- Wafer Cutting / Dicing
- Chips in Waffle Pack
- Chip Bonding and Wire Bonding
- Packaging / Housing of integrated circuits
- Standard packages (i. a. SOP, SSOP, QFP, FOQ, FOD)
- Special packages
- Laser Marking
- Electrical Tests and Lead Inspection
- Packing: Tray, Tube, Reel
- COB (Chip on Board) Mounting for sample quantities
- Quality Inspections
- ASIC Development
MAF Microelectronic Assembly Frankfurt (Oder) GmbH | www.maf-ffo.de