Mouser Electronics, Inc., the New Product Introduction (NPI) leader™ empowering innovation, announces a new eBook in collaboration with Analog Devices, Inc. (ADI) and Samtec, exploring the challenges and nuances involved in maintaining signal integrity in our connected world.
Between smartphones, computers and emerging fields like the Internet of Things, nearly every device in our lives is interconnected in some capacity. In 13 Experts on Signal Integrity in Radio-Frequency and High-Frequency Designs, ADI and Samtec address this by offering industry-leading components and design solutions. This eBook explores the significance of signal integrity in RF and high-frequency designs and provides solutions to meet the growing demands of modern electronics, especially in mission-critical fields like medical and automotive. The eBook highlights many of the products that both ADI and Samtec offer to allow customers to leverage both companies’ design experience, thus enabling them to easily achieve high signal integrity and meet their system design requirements with adequate specification, margin, and reliability.
ADI’s ADF4368 microwave wideband synthesiser offers clean, ultra-low jitter frequency synthesis from 800 MHz to 12.8 GHz. The need for sub-harmonic filters is eliminated due to no internal doubler required, simplifying design and reducing BOM costs.
ADI’s ADL8112 low noise amplifier (LNA), available to order, provides broadband operation from 10 MHz to 26.5 GHz. The integration of an amplifier and two single-pole, four-throw (SP4T) reflective switches allow multiple paths through the device. With the integration of power supply decoupling capacitors, minimal external power supply decoupling is required.
ADI’s ADPA7009-2 GaAs pHEMT MMIC power amplifier provides a gain of 17.5 dB, an output power for 1dB compression (OP1dB) of 28 dBm, and a typical output third-order intercept (OIP3) of 34.5 dBm at 20 GHz to 35 GHz. The RF input and outputs are internally matched and DC-blocked for easy integration into higher-level assemblies. Most of the typically required external passive components for operation are integrated, facilitating a small, compact printed circuit board (PCB) footprint.
The Samtec AcceleRate® HD ultra-dense mezzanine strips are super-dense micro interconnects with up to 240 total inputs/outputs (I/Os). These connectors are PCIe® Gen 5 compatible, support 56 Gbps PAM4 (28 Gbps NRZ) applications, and feature an Edge Rate® contact system that is optimised for signal integrity performance.
The SEARAY™ SEAF and SEAM connectors are high-density open-pin-field arrays. The open-pin design gives customers the ability to simultaneously run differential -pairs, single-ended signals, and power through the same 28+ Gbps interconnect. SEARY’s breakout region is simplified by utilising Samtec’s proprietary Differential Vias™ technology. This method enables wider routing channels with a 2:1 ground-to-via ratio, improves signal integrity at high data rates, and lowers overall cost.
The HSEC8-RA high-speed edge card connectors feature Samtec’s rugged Edge Rate contact system and are designed for signal integrity and multiple mating cycles. These connectors offer superior impedance control, reduced broadside coupling (crosstalk), and a 1.2 mm contact wipe distance.
• To learn more about ADI, visit https://eu.mouser.com/manufacturer/analog-devices/. To learn more about Samtec, visit https://eu.mouser.com/manufacturer/samtec/.
• To read the 13 Experts on Signal Integrity in Radio-Frequency and High-Frequency Designs eBook, visit
https://analog.mouser.com/adi-ebooks/13-experts-on-signal-integrity/.
• To browse Mouser’s extensive eBook library, visit https://resources.mouser.com/manufacturer-ebooks/.