Murata will showcase a wide range of innovative connectivity and mobility at Embedded World (Nuremberg, 9th-11th April). Amongst the wide range of engaging demonstrations, visitors to the company’s stand (4A-646) will be able to explore how the new Type 2GT multi-band LoRa module reports sensor data to the Cloud. Those interested in cellular and IoT solutions can visit Murata’s second booth (Hall 3-228) to discover the company’s global alliance that combines a unified Device Management Platform with Zero-Touch Secure Connection, eSIM, and one SKU Cellular Module to drive the growth of the IoT Adoption and cellular market.
Murata’s Type 2GT module with Semtech’s advanced LR1121 RF transceiver IC offers a turnkey solution for lower-cost assembly and faster time to market with a pre-certified LR1121 variant readily available. “With this offering, we have created the most needed solution in the IoT market which provides multi-band LoRa® and long-range – frequency hopping spread spectrum (LR-FHSS) communication over sub-GHz and 2.4GHz ISM bands as well as licensed S-Band for satellites,” said Hirokazu Nakae, General Manager, Connectivity Module Development Department at Murata. “The new multi-band module allows designers to develop products with a faster time to market by minimizing BOM size, cost and complexity.”
Visitors will also be able to see how the Type 1WL LoRaWAN module can be used as a LoRaWAN Relay to extend the coverage as well as a LoRaWAN End Device to report data to the Cloud. The Type 1WL geolocation module from Murata encapsulates all high-density and high-complexity parts, requiring only a low-complexity PCB and user code to develop any target use case, reducing production test time to a minimum. As it is multi-technology fused, the Type 1WL offers ultra-low power design for long battery life, superior sensitivity, and high flexibility to build low-cost Internet of Things (IoT) tracking devices for both indoor and outdoor environments.
Murata will also showcase its Type2EL module which is highly optimized to meet the exacting demands of next-generation IoT hardware – where having MatterTM connectivity is set to become an increasingly important expectation. This module is based on a highly integrated IW612 single-chip 2.4/5GHz solution from NXP, which covers a broad array of different wireless protocols. Through this, 1×1 dual-band Wi-FiTM (IEEE 802.11a/b/g/n/ac/ax), Bluetooth® 5.3, and IEEE 802.15.4 are all incorporated into the Murata tri-radio module.
Regarding mobility solutions, Murata will showcase its new phone as a key (PaaK) solution. Utilizing UWB and BLE technology, no internet connectivity is required with standardized systems existing for automotive, home, and office lock types. The solution is also Car Connectivity Consortium (CCC) Digital Key compliant for authentication and sharing.
Visitors to Hall 3 stand 228 will see how the Alliance delivers faster development terms, lower total costs, lower power consumption, optimized cellular connectivity traffic, and lower supplier engagement effort for all Cellular IoT developers as a total solution. To effectively implement widespread IoT solutions, companies require a rapid, scalable, and efficient deployment supported by cost-effective management systems and energy-efficient hardware that facilitates battery-operated designs. This is especially true for small and medium-sized enterprises, which lack the negotiating power and resources of larger organizations. In order to operate in more than one region, companies also typically have to manage multiple contracts and SKUs with numerous cellular Connectivity Service Providers (CSPs), on different networks, further increasing the complexity of widespread IoT deployment.
Attendees will also be able to explore a wide range of new Murata products, including low-cost Wi-Fi modules, STM32 platform-supporting solutions, cellular IoT and tracking devices.
To talk about your connectivity and mobility projects with Murata’s highly knowledgeable application engineering staff, come to Stand 646 in Hall 4A and Stand 228 in Hall 3.