Microchip announces an integrated switching power module designed specifically for height-constrained telecom, industrial and solid-state drive (SSD) applications. The new MIC45404 comes in a thermally-enhanced package that incorporates inductors and passive components into a single, moulded power converter. The slim 10 x 6 x 2 mm package saves space in customers’ designs, simplifies board design, and eliminates concern over passive components that may introduce unexpected electromagnetic interference (EMI).
According to IHS, the global power-module market is projected to comprise nearly one third (30 percent) of the power semiconductor market by 2019, growing at twice the rate of power discretes (from 2014 to 2019). Microchip is well-positioned in this market, in part because it has developed a process that puts all passives on a thermally-enhanced lead-frame that reduces the distance between the components, which minimises radiated emissions and improves thermal dissipation.
The MIC45404 incorporates one of the thinnest integrated magnetic inductors available in a 19V, 5A point-of-load buck converter. Integrated components include the controller, metal-oxide semiconductor field-effect transistors (MOSFETs), feedback path, and pulse width modulation (PWM) switching regulator. The low profile of the MIC45404 module allows it to be placed on the back of a PCB, on a daughter card, or other placement where vertical height may be constrained in point-of-load power conversion, telecom and industrial applications.
The MIC45404 is available today for sampling and volume production in a 10 x 2 x 6 mm QFN package. Pin-selectable output voltages, switching frequencies, and current limits provide further design flexibility and space savings.
Microchip today also introduced the MIC45404 Evaluation Kit (MIC45404YMP-EV), priced at $55.00, which enables application development with the integrated switching power module.
For more information, visit Microchip’s Web site at: www.microchip.com/MIC45404
Microchip Technology
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