Kontron, a global leader in IoT/Embedded Computing Technology (ECT), is expanding its portfolio of SMARTCASE™ products, consisting of 5 variants to date, to include the SMARTCASE™ S711. The case kit is specifically designed for the D3713-V/R mini-ITX motherboard. The industrial motherboard with variants of different APUs from the AMD Embedded Ryzen™ V1000 and R1000 series will be complemented in March with the low power variant D3713-R1 with AMD Embedded Ryzen™ R1102G APU and a TDP value of only 6 watts.
Thanks to the enormous scalability of computing power, functionality and TDP values from 6 to 54W, the D3713-V/R is ideally suited for the most diverse customer requirements in different markets with just one system design. The new “kit” consists of the SMARTCASE™ S711 chassis, the D3713-V/R mITX motherboard designed and manufactured in Germany, a cooling solution and other comprehensive accessories.
The SMARTCASE™ S711 features a dual front USB 3.1 Gen1 port, a slot for low-profile expansion cards, and extensive USB/GbE and COM ports on the rear panel. The small dimensions of 52 x 250 x 191mm allow for a wide deployment scenario, covering a variety of customer requirements. The high-performance onboard graphics of the D3713-V/R mITX motherboard offers up to 4x DP as well as 1x eDP, Dual LVDS and allows the realization of demanding displays. In terms of power supply, the new member of the SMARTCASE™ family scores with a flexible DC wide-range voltage input of 8-36V. An equally flexible M.2/Mini PCIe expansion interface support is part of the standard equipment. The SMARTCASE™ S711 can be cooled either actively or passively.
As with all SMARTCASE™ chassis kits, the case, motherboard and cooling solution are optimally matched and climate-tested, as well as CE-certified at the system level. Due to the series production of the SMARTCASE™ chassis with series composite tools, the new model convinces with high-quality manufacturing and an attractive price-performance ratio.
First samples of the SMARTCASE™ S711 will be available from April 2021.