Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is expanding its wireless portfolio of high-performance, reliable and secure offerings. The newly developed AIROC™ brand now includes the industry’s first 1×1 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for the IoT, enterprise and industrial applications, and its first 2×2 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for multimedia, consumer and automotive applications. The Wi-Fi 6/6E combo solutions operate in the 2.4 GHz, 5 GHz, and the new, greenfield 6 GHz spectrum to deliver robust performance and minimal latency. This makes them ideal for high-quality video and audio streaming applications like gaming consoles, AR/VR, smart speakers, media-streaming devices and automotive Infotainment. Applications that require an instant response – like security systems and industrial automation – will also benefit from Infineon’s new products.
Infineon’s AIROC Wi-Fi 6/6E-certified solutions go above and beyond the standard requirements to elevate user experience with advanced wireless technology and architectural innovations that result in:
- Double the wireless coverage range compared to Wi-Fi 5 and Wi-Fi 4
- 40 percent more coverage than typical Wi-Fi 6/6E solutions
- Improved connection robustness with enhanced interference mitigation
- Lower latency and better Wi-Fi/BT Coexistence that improves multimedia streaming and gaming responsiveness in overlapping network environments
- Over 20 percent power savings, enabling longer battery life
- Multi-layer security protections with secured boot, firmware authentication and encryption, and lifecycle management, enabling a higher level of security for IoT applications.
“AIROC Wi-Fi 6/6E combo solutions address the challenges of congested 2.4 GHz and 5 GHz channels, and bring extraordinary audio and video quality for media applications and robust, long-range connections for IoT applications,” said Vikram Gupta, Senior Vice President of Infineon’s IoT Compute and Wireless Business Unit.
Infineon’s AIROC Wi-Fi 6/6E solutions are also equipped with the latest Bluetooth 5.2 technology, enabling high-quality audio with LC3, and enabling new BLE audio use cases such as audio sharing and audio broadcast. The unique low-power Wake-on-Bluetooth LE mode allows the host CPU to conserve power while the Bluetooth core autonomously “listens” for incoming connection requests. Advanced wireless technology innovations have been added to improve BT/BLE range, robustness, latency and power savings above and beyond standard BT5.2. Infineon’s unique Smart Coex™ maximizes Wi-Fi throughput when used concurrently with Bluetooth, and optimizes for demanding multi-media use cases.
Infineon’s module partners build Wi-Fi 6/6E integrated solutions that allow for rapid development, reduced test costs, and product certification. “Collaborating with Infineon allows us to leverage our combined expertise to develop innovative Wi-Fi solutions which further build upon our market-leading position,” said Akira Sasaki, General Manager of Murata. “Our most recent collaboration is a Wi-Fi 6/6E CYW5557x module that delivers advanced technology integration, superb network quality, and enables fast time-to-market. Further, it can be delivered through Murata’s extensive sales and distribution channel.”
“LG Innotek is excited to partner with Infineon on the new Wi-Fi 6E communication module which carries the CYW89570 chip,” said Insoo Ryu, Vice President Automotive Components & Electronics Business Division, LG Innotek. “This module extends LGIT’s automotive/industrial product family into the next generation and brings the latest Wi-Fi 6E and Bluetooth 5.2 standards to automotive platforms.”
For automotive applications, u-blox builds AECQ100 qualified and industrial modules with Infineon’s Wi-Fi 6E combo solution. “At u-blox, we are excited to work with Infineon on the new CYW89570,” said Hakan Svegerud, Senior Director Product Strategy, u-blox. “Based on these solutions, we will extend our successful JODY module family with global automotive and industrial grade modules, providing cutting edge technologies including Wi-Fi 6, Wi-Fi 6E and Bluetooth 5.2 to our customers.”
“nFore’s NF3327PQ Combo module has Infineon’s CYW89570 chipset inside. Infineon’s CYW89570 chipset is the perfect chipset for enabling Wi-Fi 6 and Bluetooth 5.2 technologies for automotive customers,” said Mr. Yu Zongyuan, CEO of nFore Technology.
Availability
The AIROC Wi-Fi 6 / 6E and Bluetooth 5.2 combo is currently sampling to select customers. It will be on display at Infineon’s virtual Embedded Solutions Conference 2021. More information is available at www.cypress.com/products/cyw5557x and www.cypress.com/products/automotive-wireless.