Toshiba Electronics Europe has launched a Hardware Development Kit (HDK) and Software Development Kit (SDK) …
Industries
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IndustriesIoTWireless
Microchip Releases New Multizone Technology for Whole-Home-Audio and Multi-Room Applications Based on the JukeBlox® Platform
by donpedroMicrochip Technology Inc. announced from the Hong Kong Electronics Fair the release of its second …
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“Internet of Things” was one of the biggest buzz words of 2014 however were the …
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How to perform a simple link budget analysis to evaluate wireless transmission using sub-GHz modules …
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IndustriesIoTWireless
Microchip’s new 5 GHz Power Amplifier Module extends the range and reduces production costs of WLAN applications based on IEEE 802.11ac Wi-Fi® standard
by donpedroMicrochip announces its new SST11CP22 5GHz Power Amplifier Module (PAM) for the IEEE 802.11ac ultra-high …
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IndustriesIoTWireless
Freescale i.MX 6SoloX takes applications processor security to new levels
by donpedroFreescale Semiconductor announces volume availability of i.MX 6SoloX, a highly integrated, multi-market applications processor enabling …
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Integrated Device Technology, Inc. introduced its “Wireless Power Share™” technology, a cutting-edge innovation that will …
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Integrated Device Technology, Inc. (IDT®) announced that Samsung adopted an IDT wireless power transmitter to …
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IndustriesIoTWireless
New Digi ConnectCore 6 Module Adds Wireless M2M Connectivity to Devices
by donpedroDigi International announced ConnectCore® 6, the world’s first surface mount multi-chip module with built-in wireless …
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Digi International announced the launch of the XBee® ZigBee Cloud Kit, a new all-in-one kit …