Xiamen Hongfa Electroacoustic Co., Ltd (Hongfa) has designed the industry’s highest performance and smallest active …
Industries
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Power devices
Ultra-compact DFN8x8 packaged 650V SiC MOSFETs (TW031V65C, TW054V65C, TW092V65C, and TW123V65C) from Toshiba enhance power density and efficiency in industrial equipment
by gabiToshiba Electronics Europe GmbH announces volume shipments of its 3rd generation, 650V silicon carbide (SiC) …
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Development boards
New at Mouser: BeagleBoard CC33 2.4GHz Wi-Fi 6 Bluetooth LE Wireless Modules
by gabiMouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation …
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Power modules
Infineon will supply Rivian’s R2 Platform with power modules for electric vehicle traction inverters
by gabiInfineon Technologies AG will supply Rivian’s R2 platform with power modules for traction inverters. The …
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Automotive/Transportation
Asahi Kasei Microdevices and Dirac Partner to Meet Growing Demand for High-Fidelity In-Car Audio Performance
by gabiLeading semiconductor manufacturer Asahi Kasei Microdevices (AKM) and Swedish digital audio pioneer Dirac have announced …
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Soldering pastes & materials
The Art of Soldering – Recognising and Avoiding Sources of Defects (Part 2)
by gabiSoldering, a technique that originated in ancient Egypt, is indispensable in electronics production today. Despite …
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Cybersecurity
Microchip Brings Hardware Quantum Resistance to Embedded Controllers – MEC175xB
by gabiDriven by advancements in cryptographic research and the need for stronger security measures, the National …
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Industry 4.0
Clea’s integration with Raspberry Pi OS provides customers a reference for enabling scalable Industrial IoT
by gabiSECO’s Clea is now readily available through Raspberry Pi OS — a development shared by …
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