A flat design and high graphics performance is absolutely necessary for machine building or HMI terminals. Both have been consistently implemented in the tKINO-ULT3 Mini-ITX board (170x170m) from ICP Deutschland. The small mounting depth of 27.6mm is the result of a soldered SoC, an integrated case fan in the heat sink, horizontal oriented RAM sockets and flat connectors. The tKINO-ULT3 derives its performance from an Intel® Core® i3, i5, i7 or Celeron® on-board SoC of the Skylake ULT series. It can be equipped with up to 32GB DDR4 SO-DIMM memory. Due to a HDMI 1.4, a HDMI+DP combo port as well as a LVDS/eDP (optional), three independent displays with a resolution of 4K UHD can be activated. By use of the eMMC 5.0 port the storage capacity can even be doubled (max.32GB), if required. For expansion there are two full-size PCIe Mini Card slots (mSATA support and one SIM-holder) and one PCIE x4 slot available. The interaction of on-board SIM-holder and additional 3G module enables the accomplishment of remote management and configuration tasks. Four internal RS-232 and two RS-232/422/485 interfaces offer developers maximum freedom of design in order to connect peripherals such as scanner and camera in confined space. Even for extreme temperatures from -20°C to +60°C and fluctuating input voltage (9VDC~36VDC) the tKINO-ULT3 is suitable.
Applications:
• Machine Building
• HMI terminal
• Digital Signage
ICP Deutschland GmbH | www.icp-deutschland.de