FeaturePak Embedded I/O Comes to SUMIT-ISM Stacks

by donpedro

Diamond Systems Corp., a leading supplier of ruggedized single-board computers (SBCs) and I/O expansion modules targeting real-world applications, unveiled an adapter board that allows the use of FeaturePak I/O expansion modules in systems that provide SUMIT-ISM expansion stack locations.

The FeaturePak socket on the SUMIT/FP Adapter consumes a single PCI Express x1 lane from the SUMIT-A bus connector on the SUMIT-ISM module. The adapter provides a pair of 50-pin I/O header connectors for convenient access to all FeaturePak I/O. In addition, it includes pass-through connectors for the SUMIT-ISM stack’s SUMIT-B bus and PC/104 (ISA) bus. An extended operation temperature range of -40°C to +85°C is supported.

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