DFI, a global leader in embedded motherboards and industrial computers, will join DEEPX at CES 2025 to unveil new industrial edge AI platforms integrated with the DX-M1 AI accelerator, targeting smart city applications. This collaboration reflects a shared commitment to advancing on-device and application-specific AI, paving the way for a more flexible, efficient, and sustainable edge AI adoption.
According to Research and Markets, the global edge AI market is projected to grow at a 20.54% CAGR, increasing from US$23.571 billion in 2024 to US$59.978 billion by 2029. By integrating the DX-M1 AI accelerator into its advanced hardware platforms, DFI delivers powerful solutions that address the rising demand for scalable and energy-efficient AI capabilities. These integrated platforms—which combine DFI’s industrial-grade hardware with the advanced AI processing power of the DX-M1—leverage the DX-M1’s capabilities to handle over 16 video channels on a single chip, achieve real-time processing at over 30 fps with GPU-level precision, and deliver up to 25 TOPs of AI performance while reducing energy consumption. This versatility enables the simultaneous execution of AI algorithms, such as object recognition and image classification, making them ideal for applications in industrial robots, machine vision, AI-driven IPC and HPC, smart factories, and beyond.
To demonstrate this vision, DFI will showcase two fanless embedded systems—the EC710-ASL and EC600-RPS—featuring the DEEPX DX-M1 M.2 AI accelerator. These platforms are designed to meet critical real-time demands in smart cities, enabling applications like smart transportation, surveillance, and accident prevention. The system are powered by Intel® Atom® and Intel® 14th/13th/12th Gen processors, and support Intel® Time Coordinated Computing (Intel® TCC) technology for precise real-time operations while maintaining low power consumption and minimal latency.
DFI further underscores its commitment to advancing industrial-grade embedded solutions through recent product launches, including the ASL253 single board computer with Intel® Atom® processors, the EB100-MTU NUC system featuring Intel® Core™ Ultra Processors, in-house Out-of-Band (OOB) modules, and the DFI Workload Platform. These innovations enhance hardware performance, streamline remote management with OOB capabilities, and optimize AI efficiency to address the growing demands of edge AIoT. Together with DEEPX, DFI is equipping industries with next-generation tools for sustainable, future-ready AI deployment.
DFI is confident in the transformative potential of edge AI and is leveraging its partnership with DEEPX to drive global growth and innovation. Through collaboration with channel partners and leading semiconductor companies, DFI is expanding its global presence while delivering tailored embedded IoT solutions for diverse customer needs. Visit DFI at the DEEPX booth (#9045) during CES 2025 (January 7–11) in the North Hall, Las Vegas Convention Center, to explore our edge AI platform designed for smart city applications.