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Home SMT PCB Design Freescale

Wafer Level Chip Scale Package (WLCSP)

11 MARCH 2015

This document provides guidelines to use the Wafer Level Chip Scale Package (WLCSP) to ensure consistent Printed Circuit Board (PCB) assembly necessary to achieve high yield and reliability. However, variances in manufacturing equipment, processes, and circuit board design for a specific application may lead to a combination where other process parameters yield a superior performance. […]

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