Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today introduced the RAA489118 buck-boost …
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Embedded Computing
Major milestone achieved by Farnell as company marks distribution of 10 million micro:bits
Farnell announced, in partnership with the Micro:bit Educational Foundation, that it has reached the significant …
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Power devices
Next-generation fixed-direction voltage level translators from Nexperia reduce power consumption and pin count
Nexperia released a new family of next-generation fixed-direction voltage level translators ideal for use with …
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Würth Elektronik’s popular reference book Trilogy of Connectors has been published in its 4th edition. …
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Active components
Nisshinbo Micro Devices and Rutronik announce franchise expansion in the USA: Sensor and analog devices for Industrial, Automotive, and Consumer Electronics
Rutronik Elektronische Bauelemente GmbH, one of the leading broadline distributors of electronic components, and Nisshinbo, …
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Artificial intelligence
Now at Mouser: Raspberry Pi’s Hailo 8L AI Kit for Complex AI Vision Applications
Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation …
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Soldering pastes & materials
SolderKing Celebrates a Year of Expansion, Innovation, and Sustainability Achievements
SolderKing Assembly Materials Ltd, a leading UK-based manufacturer of soldering materials and consumables, has wrapped …
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Technological and societal changes are forcing industrial companies around the world to make changes – …
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Manufacturing and Materials
Tresky offers a wide range of application options for ultrasonic DIE bonding
Ultrasonic DIE bonding is a fast, clean and efficient technology increasingly utilized in the semiconductor …
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Power devices
CCPAK1212 package pushes the performance of Nexperia’s power MOSFETs to the next level
Nexperia announced the launch of 16 new 80 V and 100 V power MOSFETs in …