Ultrasonic DIE bonding is a fast, clean and efficient technology increasingly utilized in the semiconductor …
-
-
Power devices
CCPAK1212 package pushes the performance of Nexperia’s power MOSFETs to the next level
Nexperia announced the launch of 16 new 80 V and 100 V power MOSFETs in …
-
As the year draws to a close, Farnell Global, a fast and reliable distributor of …
-
Test & Equipment
Tektronix Announces Special Pricing and Extended 5-Year Total Protection on Select Oscilloscopes, Exclusively for Educators
Tektronix, Inc., a global leader in test and measurement solutions, is excited to announce special …
-
Automotive/Transportation
Mouser Spotlights Automotive Zonal Architecture in New eBook from TE Connectivity and Microchip Technology
Mouser Electronics, Inc., the authorised global distributor with the newest electronic components and industrial automation …
-
Power supplies
Advanced Energy Expands Range of Ultra-High Power Density Configurable Power Supplies for Industrial and Medical Applications
Advanced Energy – a global leader in highly engineered, precision power conversion, measurement and control …
-
Power devices
Navitas Showcases Breakthroughs in GaN and SiC Technologies for AI Data Centers, EVs, and Mobile Applications at CES 2025
Navitas Semiconductor, the only pure-play, next-generation power semiconductor company and industry leader in gallium nitride …
-
Power devices
Nexperia launches miniaturized leadless logic ICs to save space and enhance reliability in automotive applications
Nexperia introduced a new portfolio of logic ICs in tiny automotive-qualified MicroPak XSON5 leadless packaging. …
-
Companies
UK-headquartered optoelectronics specialist celebrates 40 years of innovation & manufacturing excellence
OMC is reflecting on 40 years of innovation and commitment to manufacturing excellence as the …
-
Wurth Electronics Midcom Inc., German Branch, with EU headquarters in Munich, has opened a laboratory …
