Intel® remains true to its code naming and launches the next CPU generation with the …
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Power devices
AC/DC flyback controllers from Nexperia enable higher power density GaN-based flyback converters
Nexperia today introduced a new series of AC/DC flyback controllers as the latest additions to …
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Satisfying mission assurance requirements for the most critical space programs, Microchip Technology’s Radiation-Tolerant (RT) RTG4™ …
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Design
Mouser Electronics Unveils Dynamic New Circuit Showdown Competition Featuring Engineering Students in a Design Standoff
Mouser Electronics, Inc., the New Product Introduction (NPI) leader™ empowering innovation, today announced its sponsorship …
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Power devices
Toshiba Releases TCKE9 Series Compact Electronic Fuses (eFuse ICs) for High-Voltage Power Management Applications
Toshiba Electronics Europe GmbH (“Toshiba”) has launched 2 new products to its electronic fuse (eFuse …
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IO-Link
Renesas Introduces Four-Channel Master IC and Sensor Signal Conditioner for the Growing IO-Link Market
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today introduced two semiconductor solutions …
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With the FLYC-300, ICP Germany offers a particularly light and compact embedded system for use …
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Automotive/Transportation
Vicor releases highest density automotive-grade power modules, enabling 48V power systems for electric vehicles
Vicor has released three automotive-grade power modules for 48V EV systems, which deliver industry-leading power …
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Companies
Infineon launches SECORA™ Pay Green – the world’s first contactless payment card technology allowing for up to 100% reduction in plastic waste
Infineon Technologies AG is paving the way to a significant reduction of plastic waste and …
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Cables/Connecting
TE Connectivity presents numerous highlights around connectivity and sensors for future-oriented applications at the SPS trade fair in Nuremberg
TE Connectivity, a world leader in connectors and sensors, will be presenting selected product highlights …