Due to increasing miniaturization and packing density on assemblies Plasmatreat GmbH has recorded a higher …
Author
donpedro
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Cables/ConnectingProducersProductsTE Connectivity
TE Connectivity introduces AMPMODU connectors with 2 mm centerlines for board signal transfers
by donpedroTE Connectivity (TE), a world leader in connectivity and sensors, is expanding its range of …
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Embedded ComputingEmbedded SystemsFPGAsProducersRenesas
Renesas Expands Access to Portfolio of Leading-Edge IP Licenses
by donpedroAdditional IP Solutions Include Latest Cutting-Edge 7nm Process TCAM and Most Advanced Standard Ethernet TSN …
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Embedded ComputingEmbedded SystemsICP DeutschlandProducers
Thin-Mini ITX Board with Coffee-Lake Octa/Hexa-Core Processor Support
by donpedroMain feature of the new Thin-Mini-ITX Board PH14FEI from ICP Germany is the support of …
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Würth Elektronik introduces WE-SMGS solderable seal
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IndustriesTest & Equipment
New BRIC ultra-high-density PXI switching matrix modules from Pickering Interfaces demonstrate company’s commitment to increased performance and switching density
by donpedroCompany shows a wide range of test and verification solutions at Productronica
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Embedded ComputingEmbedded SystemsIoTIoT applicationsKontronProducers
Kontron introduces COM Express® Type 7 module for low-power entry-level server platforms in compact form factor
by donpedroNew Kontron COMe-cDV7 Computer-on-Module powered by Intel Atom® processor C3000 product family CPUs offers scalable …
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Microchip TechnologyPower devicesPower modulesPower suppliesProducers
Microchip solves interoperability challenges of delivering up to 90 Watts of Power over Ethernet wiring
by donpedroMicrochip enables both pre-standard and IEEE-compliant Powered Devices (PDs) to receive up to 90W of …


