Embedded World 2020: ARIES Embedded Integrates Industry’s First Multi-Core RISC-V System-on-Chip FPGA
-
-
NexperiaPower devicesPower modulesProducers
Nexperia extends market-leading low RDS(on) MOSFET performance with the release of its 0.57 mΩ product in LFPAK56
Safe Operating Area, Drain Current and Gate Charge also optimised
-
ICP Germany completes its portfolio of AI accelerator cards with the Mustang-M2BM-MX2 card. In addition …
-
Artificial intelligenceDevelopment boardsEmbedded SystemsIoTIoT applications
Farnell Showcasing Next-Generation Technologies in AI and Machine Learning, Connectivity, Sensing and Power at Embedded World
Win one of 1,000 AI and IoT development kits by registering online and visiting Farnell …
-
IPTE, among the world’s leading suppliers of automated production equipment for the electronics and mechanics …
-
Berlin-based company presents its latest innovations in February 2020
-
Electronics ComponentsKEMETPassive componentsProducers
KEMET’s New Metallized Polypropylene Film Capacitors Enable Growth in Electric Automotive Technology
R41T and R76H series offer a high-power density solution for harsh environments and electric vehicle …
-
Indium CorporationProducersSMTSoldering pastes & materials
Indium Corporation Announces New Jetting Solder Paste
Indium Corporation continues to develop innovative solder paste solutions to fit customers’ needs. PicoShot™ NC-5M …
-
Embedded ComputingEmbedded SystemsKontronProducersSoC / SiP / SoM / SBC
Powerful, compact and ready2use – the new Kontron System-on-Module (SoM)
Kontron offers smallest SoM module with high-performance processor i.MX8M Mini Quad Core 1.6 GHz and …
-
The increasing electrification of onboard vehicle systems is one of the major trends of the …