Farnell announced, in partnership with the Micro:bit Educational Foundation, that it has reached the significant …
Applications
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Power devices
Next-generation fixed-direction voltage level translators from Nexperia reduce power consumption and pin count
Nexperia released a new family of next-generation fixed-direction voltage level translators ideal for use with …
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Artificial intelligence
Now at Mouser: Raspberry Pi’s Hailo 8L AI Kit for Complex AI Vision Applications
Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation …
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Technological and societal changes are forcing industrial companies around the world to make changes – …
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Manufacturing and Materials
Tresky offers a wide range of application options for ultrasonic DIE bonding
Ultrasonic DIE bonding is a fast, clean and efficient technology increasingly utilized in the semiconductor …
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Power devices
CCPAK1212 package pushes the performance of Nexperia’s power MOSFETs to the next level
Nexperia announced the launch of 16 new 80 V and 100 V power MOSFETs in …
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As the year draws to a close, Farnell Global, a fast and reliable distributor of …
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Automotive/Transportation
Mouser Spotlights Automotive Zonal Architecture in New eBook from TE Connectivity and Microchip Technology
Mouser Electronics, Inc., the authorised global distributor with the newest electronic components and industrial automation …
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Power devices
Navitas Showcases Breakthroughs in GaN and SiC Technologies for AI Data Centers, EVs, and Mobile Applications at CES 2025
Navitas Semiconductor, the only pure-play, next-generation power semiconductor company and industry leader in gallium nitride …
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Power devices
Nexperia launches miniaturized leadless logic ICs to save space and enhance reliability in automotive applications
Nexperia introduced a new portfolio of logic ICs in tiny automotive-qualified MicroPak XSON5 leadless packaging. …