Ultrasonic DIE bonding is a fast, clean and efficient technology increasingly utilized in the semiconductor …
Applications
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Power devices
CCPAK1212 package pushes the performance of Nexperia’s power MOSFETs to the next level
Nexperia announced the launch of 16 new 80 V and 100 V power MOSFETs in …
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As the year draws to a close, Farnell Global, a fast and reliable distributor of …
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Automotive/Transportation
Mouser Spotlights Automotive Zonal Architecture in New eBook from TE Connectivity and Microchip Technology
Mouser Electronics, Inc., the authorised global distributor with the newest electronic components and industrial automation …
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Power devices
Navitas Showcases Breakthroughs in GaN and SiC Technologies for AI Data Centers, EVs, and Mobile Applications at CES 2025
Navitas Semiconductor, the only pure-play, next-generation power semiconductor company and industry leader in gallium nitride …
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Power devices
Nexperia launches miniaturized leadless logic ICs to save space and enhance reliability in automotive applications
Nexperia introduced a new portfolio of logic ICs in tiny automotive-qualified MicroPak XSON5 leadless packaging. …
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Companies
UK-headquartered optoelectronics specialist celebrates 40 years of innovation & manufacturing excellence
OMC is reflecting on 40 years of innovation and commitment to manufacturing excellence as the …
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Wurth Electronics Midcom Inc., German Branch, with EU headquarters in Munich, has opened a laboratory …
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Murata will introduce a selection of its next-generation technologies at CES 2025 (7th – 10th …
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Power devices
Improve the efficiency and reliability of switching power supplies: Vishay’s 1,200 V 3rd generation SiC Schottky diodes – at Rutronik
The 3rd generation of 1,200 V SiC Schottky diodes (5 A – 40 A) with …
